Applications

Explore AI bond-shape classification, optical metrology and X-ray inspection for bonds, wires and microbumps.

WireBond · Vision AI

Classify bond shapes from inspection images with vision AI, using contour and shape features to support appearance assessment.

WireBond · 2D metrology

Locate bond centers and measure ball diameter and bond width. Compare repeated acquisitions to examine measurement consistency.

WireBond · Optical 3D

Reconstruct wire trajectories from images at different focal planes and extract relative loop height to reveal the wire geometry in space.

MicroBump · Morphology

Examine tip contours, array arrangement and local shapes to compare bump morphology and identify the structures for 3D measurement.

MicroBump · 3D metrology

Measure microbump diameter, height and 3D shape with multiple projections and shadow-profile metrology to assess array geometry consistency.

WireBond · X-ray inspection

Use X-ray imaging and image processing to trace wire paths, inspect wire shape and arrangement, and observe structures inside semiconductor packages.

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