WireBond 2D / 3D inspection system
2D visual and 3D optical inspection for semiconductor packaging, covering ICs, capacitors, silver plating, lead frames, wires and bonds.
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13 items
3D surface profile inspection
Inspect wear and structural abnormalities in automotive steering shafts and racks after durability or impact testing.
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Manual 3D WireBond Inspection System
Manually load and position samples, then use microscope focus-based measurement to inspect WireBond loop height, bond geometry and position.
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IGBT 3D bond inspection
Inspect wire shape, loop height and bond positions in power devices.
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Microbump 3D metrology
Measure microbump diameter, height and 3D shape.
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Bump Manual Solder-Bump Inspection System
A manual solder-bump inspection system for package and flip-chip substrates, measuring coplanarity and inspecting tip profiles and attached foreign material.
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Microfocus X-ray system
Use a sealed microfocus X-ray source for internal radiographic observation and sample evaluation.
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Automated X-ray inspection
Combine X-ray radiography, feeding, handling and reject processing for packaged devices.
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Automated PCB X-ray inspection system
Combine X-ray radiography with conveyor handling to inspect PCBs and assembled boards. Configure imaging and automation around board construction, inspection areas and production flow.
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Confocal 3D surface metrology
Use chromatic confocal measurement for steps, protrusions, scratches and film thickness.
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Glass-lens visual inspection
Inspect glass lenses on trays using dedicated illumination and image processing.
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Pin-gauge visual inspection
Combine dedicated optics, a line-scan camera and positioning for pin-gauge inspection.
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SmartInsight
Enterprise data, reporting and natural-language queries
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