Manual 3D WireBond Inspection System
Manually load and position samples, then use microscope focus-based measurement to inspect WireBond loop height, bond geometry and position.
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Product GENSTAR / SEMICONDUCTOR INSPECTION
WireBond 2D / 3D inspection system
2D visual and 3D optical inspection for semiconductor packaging, covering ICs, capacitors, silver plating, lead frames, wires and bonds.
2D pixel resolution1.2μm / Pixel
3D pixel resolution0.6μm / Pixel
WIREBOND2D / 3D OPTICAL
APPLICATION & METHOD
From component surfaces to wires and bonds.
Combine 2D appearance and position inspection with 3D optical shape information for components, wires and bonds. Confirm imaging and decision methods for each item using actual samples.
01
ICs and capacitors in semiconductor packages
02
Silver-plated and lead-frame surfaces
03
Wires and bonds
TECHNICAL SPECIFICATIONS
2D / 3D specifications
| Parameter | 2D | 3D |
|---|---|---|
| Pixel resolution | 1.2μm / Pixel | 0.6μm / Pixel |
| Inspection cycle time | < 1.5s / field of view | < 5s / field of view |
Pixel resolution describes image sampling, not measurement accuracy. Cycle time is per field of view; system throughput also depends on field count and handling.
INSPECTION MATRIX
Inspection items & defect modes
| Category / area | Inspection items & defect modes |
|---|---|
| IC | CracksFracturesForeign materialPlacement offsetEdge chippingSurface scratchesMissing die |
| Capacitors | CracksForeign materialPlacement offset |
| Silver plating | Uneven silver plating |
| Lead frames | Foreign material |
| Wires | Bent wiresWire shortsBroken wiresCrossed / overlapping wiresWire thicknessIndentationsMissing wiresWire sagWire pitchLoop height (3D)Wire–chip clearance (3D) |
| Bonds | Presence / absencePosition offsetAbnormal shapeForeign materialFloating (Y offset)Ball diameterBond widthBond height (3D) |
Inspection items depend on package type, equipment configuration and sample validation. Items marked 3D require the corresponding measurement module.
SAMPLE EVALUATION
Confirm the configuration with actual samples.
01
Define samples and inspection items
02
Confirm fields of view and imaging
03
Validate defects and decision rules
04
Review inspection and handling time
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