WireBond 2D / 3D inspection system
2D visual and 3D optical inspection for semiconductor packaging, covering ICs, capacitors, silver plating, lead frames, wires and bonds.
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Product GENSTAR / 3D
IGBT 3D bond inspection
Inspect wire shape, loop height and bond positions in power devices.
PRODUCT OVERVIEW
Product overview
- Applications
- Semiconductor bonding
- Technology
- 3D optical inspection
Inspection objects
- IGBT modules
- Power-device wires
01 / INSPECTION
Inspection & measurement
- Loop height and angle
- Bond shape and position
02 / METHOD
Inspection method
Acquire images across focal planes and analyze wire and bond geometry in 3D.
Confirm the configuration and inspection scope for the sample, field of view and production requirements.
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