Solution
Semiconductor Packaging & Bond Quality
Build a verifiable inspection workflow around bonds, wires and package geometry.
APPLICATION WORKFLOW
Application workflow
- 01Define bond regions and inspection items↓
- 02Validate lighting, positioning and height acquisition↓
- 03Review measurements and borderline samples↓
- 04Define outputs and review procedures
OVERVIEW
Define the task. Choose the method.
Build a verifiable inspection workflow around bonds, wires and package geometry.
Discuss your application01
Application challenges
2D appearance alone cannot describe wire-loop height, while package structures change occlusion and reflections.
02
Inspection & analysis
Validate 2D bond inspection, optical 3D measurement and optional AI review separately before combining them into an inspection task.
03
Evaluation & validation
Confirm the defect list and measurement references before defining the deliverable configuration.
LET'S CONNECT
Let’s discuss your needs.
Get in touch for an initial enquiry, a technical conversation or a discussion of possible solutions.